arXiv:1308.0359 [cond-mat.mes-hall]AbstractReferencesReviewsResources
Airtight metallic sealing at room temperature under small mechanical pressure
Stephen P. Stagon, Hanchen Huang
Published 2013-08-01Version 1
Here, we report a process of metallic sealing using small well-separated Ag nanorods; the process is at room temperature under a small mechanical pressure of 9.0 MPa, and also in ambient. The metallic seals have an air leak rate of 1.1 x 10-3 cm3atm/m2/day, and mechanical shear strength higher than 8.9 MPa. This leak rate meets the requirement of organic solar cells and organic light emitting diodes [1].
DOI: 10.1038/srep03066
Categories: cond-mat.mes-hall
Keywords: small mechanical pressure, room temperature, airtight metallic sealing, organic light emitting diodes, organic solar cells
Tags: journal article
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